Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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Application No.: US18118154Application Date: 2023-03-07
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Publication No.: US20230207669A1Publication Date: 2023-06-29
- Inventor: Chung-Fu Chang , Kuan-Hung Chen , Guang-Yu Lo , Chun-Chia Chen , Chun-Tsen Lu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu City
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu City
- Priority: TW 8102399 2019.01.22
- The original application number of the division: US16282323 2019.02.22
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/51 ; H01L21/02 ; H01L21/28

Abstract:
A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a gate dielectric layer on the fin-shaped structure; forming a gate electrode on the fin-shaped structure; performing a nitridation process to implant ions into the gate dielectric layer adjacent to two sides of the gate electrode; and forming an epitaxial layer adjacent to two sides of the gate electrode.
Information query
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