Invention Application
- Patent Title: IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING
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Application No.: US17243158Application Date: 2021-04-28
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Publication No.: US20220349088A1Publication Date: 2022-11-03
- Inventor: Zhepeng CONG , Nyi Oo MYO , Tao SHENG , Yong ZHENG
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C30B25/16
- IPC: C30B25/16 ; C30B23/00 ; C30B25/12 ; C30B25/10 ; C30B23/06 ; C23C14/54 ; C23C16/46 ; C23C16/52 ; C23C16/458 ; C23C14/50 ; G01N21/55

Abstract:
Embodiments of the present disclosure generally relate to apparatus, systems, and methods for in-situ film growth rate monitoring. A thickness of a film on a substrate is monitored during a substrate processing operation that deposits the film on the substrate. The thickness is monitored while the substrate processing operation is conducted. The monitoring includes directing light in a direction toward a crystalline coupon. The direction is perpendicular to a heating direction. In one implementation, a reflectometer system to monitor film growth during substrate processing operations includes a first block that includes a first inner surface. The reflectometer system includes a light emitter disposed in the first block and oriented toward the first inner surface, and a light receiver disposed in the first block and oriented toward the first inner surface. The reflectometer system includes a second block opposing the first block.
Public/Granted literature
- US12077880B2 In-situ film growth rate monitoring apparatus, systems, and methods for substrate processing Public/Granted day:2024-09-03
Information query
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