Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICATING THE SAME
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Application No.: US17807894Application Date: 2022-06-21
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Publication No.: US20220319973A1Publication Date: 2022-10-06
- Inventor: JI HWANG KIM , HYUNKYU KIM , JONGBO SHIM , EUNHEE JUNG , KYOUNGSEI CHOI
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR SUWON-SI
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR SUWON-SI
- Priority: KR10-2019-0165011 20191211
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L25/065
Abstract:
A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.
Public/Granted literature
- US11658107B2 Semiconductor package including an interposer and method of fabricating the same Public/Granted day:2023-05-23
Information query
IPC分类:
