Invention Grant
- Patent Title: Semiconductor package including an interposer and method of fabricating the same
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Application No.: US17807894Application Date: 2022-06-21
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Publication No.: US11658107B2Publication Date: 2023-05-23
- Inventor: Ji Hwang Kim , Hyunkyu Kim , Jongbo Shim , Eunhee Jung , Kyoungsei Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20190165011 2019.12.11
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L25/065 ; H01L23/00
Abstract:
A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.
Public/Granted literature
- US20220319973A1 SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-10-06
Information query
IPC分类:
