Invention Application
- Patent Title: Method of Measuring Aberration and Electron Microscope
-
Application No.: US17576016Application Date: 2022-01-14
-
Publication No.: US20220230838A1Publication Date: 2022-07-21
- Inventor: Shigeyuki Morishita , Ryusuke Sagawa , Fuminori Uematsu , Tomohiro Nakamichi , Keito Aibara
- Applicant: JEOL Ltd.
- Applicant Address: JP Tokyo
- Assignee: JEOL Ltd.
- Current Assignee: JEOL Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JP2021-005612 20210118
- Main IPC: H01J37/153
- IPC: H01J37/153 ; H01J37/26 ; H01J37/10
Abstract:
A method of measuring an aberration in an electron microscope includes: acquiring an image for measuring the aberration in the electron microscope; and measuring the aberration by using the image. In measuring the aberration, a direction of defocusing is specified based on a residual aberration that is uniquely determined by a configuration of an optical system of the electron microscope and an optical condition of the optical system.
Public/Granted literature
- US11764029B2 Method of measuring aberration and electron microscope Public/Granted day:2023-09-19
Information query
