- 专利标题: GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING GERMANIUM-DOPED NANORIBBON CHANNEL STRUCTURES
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申请号: US16913294申请日: 2020-06-26
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公开(公告)号: US20210408285A1公开(公告)日: 2021-12-30
- 发明人: Ryan HICKEY , Glenn A. GLASS , Anand S. MURTHY , Rushabh SHAH , Ju-Hyung NAM
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/423 ; H01L29/786
摘要:
Gate-all-around integrated circuit structures having germanium-doped nanowire/nanoribbon channel structures, and methods of fabricating gate-all-around integrated circuit structures having germanium-doped nanowire/nanoribbon channel structures, are described. For example, an integrated circuit structure includes a vertical arrangement of nanowires above a substrate. Individual ones of the vertical arrangement of nanowires have a relatively higher germanium concentration at a lateral mid-point of the nanowire than at lateral ends of the nanowire.
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