Invention Application
- Patent Title: ION MILLING APPARATUS
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Application No.: US16316289Application Date: 2016-07-14
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Publication No.: US20210287871A1Publication Date: 2021-09-16
- Inventor: Kengo ASAI , Hiroyasu SHICHI , Toru IWAYA , Hisayuki TAKASU
- Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- International Application: PCT/JP2016/070846 WO 20160714
- Main IPC: H01J37/08
- IPC: H01J37/08 ; H01J37/09 ; H01J37/305

Abstract:
To provide an ion milling apparatus adapted to suppress the contamination of a beam forming electrode. The ion milling apparatus includes: an ion gun containing therein a beam forming electrode for forming an ion beam; a specimen holder for fixing a specimen to be processed by irradiation of an ion beam; a mask for shielding a part of the specimen from the ion beam; and an ion gun controller for controlling the ion gun.
Public/Granted literature
- US11257654B2 Ion milling apparatus Public/Granted day:2022-02-22
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