Invention Application
- Patent Title: Silicon Carbide Device with Trench Gate
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Application No.: US16986338Application Date: 2020-08-06
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Publication No.: US20210050421A1Publication Date: 2021-02-18
- Inventor: Caspar Leendertz , Thomas Basler , Paul Ellinghaus , Rudolf Elpelt , Michael Hell , Jens Peter Konrath , Shiqin Niu , Dethard Peters , Konrad Schraml , Bernd Leonhard Zippelius
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102019121859.4 20190814
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/78 ; H01L29/423 ; H01L29/10

Abstract:
A silicon carbide device includes a stripe-shaped trench gate structure extending from a first surface into a silicon carbide body. The gate structure has a gate length along a lateral first direction. A bottom surface and an active first gate sidewall of the gate structure are connected via a first bottom edge of the gate structure. The silicon carbide device further includes at least one source region of a first conductivity type. A shielding region of a second conductivity type is in contact with the first bottom edge of the gate structure across at least 20% of the gate length.
Public/Granted literature
- US11552173B2 Silicon carbide device with trench gate Public/Granted day:2023-01-10
Information query
IPC分类: