发明申请
- 专利标题: SHIELDED INTERCONNECTS
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申请号: US15637682申请日: 2017-06-29
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公开(公告)号: US20190006572A1公开(公告)日: 2019-01-03
- 发明人: Javier A. Falcon , Adel A. Elsherbini , Johanna M. Swan , Shawna M. Liff , Ye Seul Nam , James S. Clarke , Jeanette M. Roberts , Roman Caudillo
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L39/04
- IPC分类号: H01L39/04 ; H01L25/16 ; H01L23/538 ; H01L23/66 ; H01L23/552 ; H01L39/02 ; H01L39/24 ; H01P3/08 ; H01P11/00 ; H05K1/02 ; G06N99/00
摘要:
Disclosed herein are shielded interconnects, as well as related methods, assemblies, and devices. In some embodiments, a shielded interconnect may be included in a quantum computing (QC) assembly. For example, a QC assembly may include a quantum processing die; a control die; and a flexible interconnect electrically coupling the quantum processing die and the control die, wherein the flexible interconnect includes a plurality of transmission lines and a shield structure to mitigate cross-talk between the transmission lines.
公开/授权文献
- US10319896B2 Shielded interconnects 公开/授权日:2019-06-11
信息查询
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