Invention Application
- Patent Title: SRAM Cell and Logic Cell Design
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Application No.: US16051199Application Date: 2018-07-31
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Publication No.: US20180337189A1Publication Date: 2018-11-22
- Inventor: Fang Chen , Kuo-Chiang Ting , Jhon Jhy Liaw , Min-Chang Liang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L49/02 ; H01L27/11582 ; H01L21/8238 ; H01L23/528 ; H01L23/522 ; H01L27/088

Abstract:
An embodiment is an integrated circuit structure including a static random access memory (SRAM) cell having a first number of semiconductor fins, the SRAM cell having a first boundary and a second boundary parallel to each other, and a third boundary and a fourth boundary parallel to each other, the SRAM cell having a first cell height as measured from the third boundary to the fourth boundary, and a logic cell having the first number of semiconductor fins and the first cell height.
Public/Granted literature
- US10468418B2 SRAM cell and logic cell design Public/Granted day:2019-11-05
Information query
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