Invention Application
- Patent Title: SANDWICH EPI CHANNEL FOR DEVICE ENHANCEMENT
- Patent Title (中): 用于设备增强的SANDWICH EPI通道
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Application No.: US15267328Application Date: 2016-09-16
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Publication No.: US20170005095A1Publication Date: 2017-01-05
- Inventor: Ru-Shang Hsiao , Ling-Sung Wang , Chih-Mu Huang , Cing-Yao Chan , Chun-Ying Wang , Jen-Pan Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/165 ; H01L29/10 ; H01L21/306 ; H01L21/02 ; H01L21/8238 ; H01L29/66 ; H01L29/16 ; H01L29/06

Abstract:
The present disclosure relates to a transistor device having a channel region comprising a sandwich film stack with a plurality of different layers that improve device performance, and an associated apparatus. In some embodiments, the transistor device has a source region and a drain region disposed within a semiconductor substrate. A sandwich film stack is laterally positioned between the source region and the drain region. The sandwich film stack has a lower layer, a middle layer of a carbon doped semiconductor material disposed over the lower layer, and an upper layer disposed over the middle layer. A gate structure is disposed over the sandwich film stack. The gate structure is configured to control a flow of charge carriers in a channel region located between the source region and the drain region.
Public/Granted literature
- US10008501B2 Sandwich EPI channel for device enhancement Public/Granted day:2018-06-26
Information query
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