Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Patent Title (中): 半导体结构及其形成方法
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Application No.: US14793714Application Date: 2015-07-07
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Publication No.: US20160351575A1Publication Date: 2016-12-01
- Inventor: Ching-Wen Hung , Wei-Cyuan Lo , Ming-Jui Chen , Chia-Lin Lu , Jia-Rong Wu , Yi-Hui Lee , Ying-Cheng Liu , Yi-Kuan Wu , Chih-Sen Huang , Yi-Wei Chen , Tan-Ya Yin , Chia-Wei Huang , Shu-Ru Wang , Yung-Feng Cheng
- Applicant: United Microelectronics Corp.
- Priority: TW104116909 20150527
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L21/768 ; H01L21/8234 ; H01L21/311 ; H01L29/78 ; H01L23/535

Abstract:
The present invention provides a semiconductor structure, including a substrate, a plurality of fin structures, a plurality of gate structures, a dielectric layer and a plurality of contact plugs. The substrate has a memory region. The fin structures are disposed on the substrate in the memory region, each of which stretches along a first direction. The gate structures are disposed on the fin structures, each of which stretches along a second direction. The dielectric layer is disposed on the gate structures and the fin structures. The contact plugs are disposed in the dielectric layer and electrically connected to a source/drain region in the fin structure. From a top view, the contact plug has a trapezoid shape or a pentagon shape. The present invention further provides a method for forming the same.
Public/Granted literature
- US09613969B2 Semiconductor structure and method of forming the same Public/Granted day:2017-04-04
Information query
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