发明申请
- 专利标题: SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体器件
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申请号: US14483831申请日: 2014-09-11
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公开(公告)号: US20150262999A1公开(公告)日: 2015-09-17
- 发明人: Tsuneo Ogura
- 申请人: Kabushiki Kaisha Toshiba
- 优先权: JP2014-052702 20140314
- 主分类号: H01L27/06
- IPC分类号: H01L27/06 ; H01L29/10 ; H01L29/861 ; H01L29/739
摘要:
According to one embodiment, a semiconductor device includes first, second, and third electrodes, first, second, third, fourth, fifth, sixth, and seventh semiconductor regions. The first semiconductor region is provided between the first and second electrodes. The second semiconductor region is provided between the first electrode and the first semiconductor region. The third and fourth semiconductor regions are provided between the first electrode and the second semiconductor region. The fifth semiconductor region is positioned between the third semiconductor region and the second electrode, and is provided between the first semiconductor region and the second electrode. The sixth semiconductor region is positioned between the fourth semiconductor region and the second electrode, and is provided between the first semiconductor region and the second electrode.The seventh semiconductor region is provided between the fifth semiconductor region and the second electrode. The third electrode is provided on the seventh, fifth, and first semiconductor regions.
公开/授权文献
- US09219060B2 Semiconductor device 公开/授权日:2015-12-22
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