Invention Application
- Patent Title: CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF
- Patent Title (中): 电路材料，电路层压板及其制造方法
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Application No.: US14334876Application Date: 2014-07-18
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Publication No.: US20150030824A1Publication Date: 2015-01-29
- Inventor: Jessica Crosley
- Applicant: Rogers Corporation
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/46 ; H05K3/00 ; H05K1/02
Abstract:
A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percent of borosilicate microspheres that have been treated with an alkaline solution.
Public/Granted literature
- US09258892B2 Circuit materials, circuits laminates, and method of manufacture thereof Public/Granted day:2016-02-09
Information query
