Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US13062733Application Date: 2010-09-20
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Publication No.: US20120049249A1Publication Date: 2012-03-01
- Inventor: Huilong Zhu , Haizhou Yin , Zhijiong Luo , Huicai Zhong
- Applicant: Huilong Zhu , Haizhou Yin , Zhijiong Luo , Huicai Zhong
- Applicant Address: CN Chaoyang District, Beijing
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Chaoyang District, Beijing
- Priority: CN201010269260.0 20100831
- International Application: PCT/CN2010/001446 WO 20100920
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L21/336

Abstract:
A semiconductor structure and a method for fabricating the same. A semiconductor structure includes a semiconductor substrate; a channel region formed in the semiconductor substrate; a gate including a dielectric layer and a conductive layer and formed above the channel region; source and drain regions formed at opposing sides of the gate; first shallow trench isolations embedded into the semiconductor substrate and having a length direction parallel to the length direction of the gate; and second shallow trench isolations, each of which abuts the outer sidewall of the source or the drain region and abuts the first shallow trench isolations, in which the source and drain regions include first seed crystal layers abutting the second shallow trench isolations, and the top surfaces of the second shallow trench isolations are higher than or as high as the top surfaces of the source and drain regions.
Public/Granted literature
- US08633522B2 Semiconductor structure and method for fabricating the same Public/Granted day:2014-01-21
Information query
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