发明申请
- 专利标题： Method of attaching components to semiconductor processing chambers using diffusion bonding
- 专利标题（中）： 使用扩散接合将部件附接到半导体处理室的方法
-
申请号： US11586103申请日： 2006-10-24
-
公开(公告)号： US20070062021A1公开(公告)日： 2007-03-22
- 发明人: Mark Crockett , John Lane , Micahel DeChellis , Chris Melcer , Erica Porras , Aneesh Khullar , Balarabe Mohammed
- 申请人： Mark Crockett , John Lane , Micahel DeChellis , Chris Melcer , Erica Porras , Aneesh Khullar , Balarabe Mohammed
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： B21D35/00
- IPC分类号： B21D35/00
摘要：
The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
公开/授权文献
信息查询
