发明申请
- 专利标题: Compound semiconductor devices and methods of manufacturing the same
- 专利标题(中): 复合半导体器件及其制造方法
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申请号: US11202126申请日: 2005-08-11
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公开(公告)号: US20060205197A1公开(公告)日: 2006-09-14
- 发明人: Gyu-Chul Yi , Sung-Jin An , Yong-Jin Kim , Dong-Kun Lee
- 申请人: Gyu-Chul Yi , Sung-Jin An , Yong-Jin Kim , Dong-Kun Lee
- 申请人地址: KR Gyeongsangbuk-do KR Pohang-shi
- 专利权人: SILTRON INC.,POSTECH FOUNDATION
- 当前专利权人: SILTRON INC.,POSTECH FOUNDATION
- 当前专利权人地址: KR Gyeongsangbuk-do KR Pohang-shi
- 优先权: KR10-2005-0019605 20050309
- 主分类号: H01L31/00
- IPC分类号: H01L31/00 ; H01L21/3205 ; H01L29/739 ; H01L21/4763
摘要:
A compound semiconductor device and method of manufacturing the same. The method includes coating a plurality of spherical balls on a substrate and selectively growing a compound semiconductor thin film on the substrate on which the spherical balls are coated. The entire process can be simplified and a high-quality compound semiconductor thin film can be grown in a short amount of time in comparison to an epitaxial lateral overgrowth (ELO) method.
公开/授权文献
- US1736805A Elevator-door-locking gear 公开/授权日:1929-11-26
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