Invention Application
- Patent Title: System for improving thermal stability of copper damascene structure
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Application No.: US11090103Application Date: 2005-03-24
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Publication No.: US20050186788A1Publication Date: 2005-08-25
- Inventor: Jiong-Ping Lu , Qi-Zhong Hong , Tz-Cheng Chiu , Changming Jin , David Permana , Ting Tsui
- Applicant: Jiong-Ping Lu , Qi-Zhong Hong , Tz-Cheng Chiu , Changming Jin , David Permana , Ting Tsui
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/44
Abstract:
Disclosed is a system for fabricating a semiconductor device (100). An interconnect structure (110) is formed on the semiconductor device (100) and a cap (112) is deposited over the interconnect structure (110). The interconnect structure (110) is annealed with the overlying cap (112) in place. The cap (112) is then removed after the interconnect structure (110) is annealed.
Information query
IPC分类:
