Invention Grant
- Patent Title: Integrated circuits including composite dielectric layer
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Application No.: US16453796Application Date: 2019-06-26
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Publication No.: US12170310B2Publication Date: 2024-12-17
- Inventor: Guruvayurappan S. Mathur , Abbas Ali , Poornika Fernandes , Bhaskar Srinivasan , Darrell R. Krumme , Joao Sergio Afonso , Shih-Chang Chang , Shariq Arshad
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Andrew R. Ralston; Frank D. Cimino
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/336 ; H01L21/8234 ; H01L27/06 ; H01L49/02

Abstract:
In some examples, an integrated circuit includes an isolation layer disposed on or over a semiconductor substrate. The integrated circuit also includes a first conductive plate located over the isolation layer and a composite dielectric layer located over the first conductive plate. The composite dielectric layer includes a first sublayer comprising a first chemical composition; a second sublayer comprising a second different chemical composition; and a third sublayer comprising a third chemical composition substantially similar to the first chemical composition. The integrated circuit further includes a second conductive plate located directly on the composite dielectric layer above the first conductive plate.
Information query
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