公开(公告)号：US12170310B2

公开(公告)日：2024-12-17

申请号：US16453796

申请日：2019-06-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Guruvayurappan S. Mathur ,  Abbas Ali ,  Poornika Fernandes ,  Bhaskar Srinivasan ,  Darrell R. Krumme ,  Joao Sergio Afonso ,  Shih-Chang Chang ,  Shariq Arshad

IPC: H01L21/8238 ,  H01L21/336 ,  H01L21/8234 ,  H01L27/06 ,  H01L49/02

Abstract: In some examples, an integrated circuit includes an isolation layer disposed on or over a semiconductor substrate. The integrated circuit also includes a first conductive plate located over the isolation layer and a composite dielectric layer located over the first conductive plate. The composite dielectric layer includes a first sublayer comprising a first chemical composition; a second sublayer comprising a second different chemical composition; and a third sublayer comprising a third chemical composition substantially similar to the first chemical composition. The integrated circuit further includes a second conductive plate located directly on the composite dielectric layer above the first conductive plate.