发明授权
- 专利标题: Semiconductor device, semiconductor wafer, memory device, and electronic device
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申请号: US18142064申请日: 2023-05-02
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公开(公告)号: US12125849B2公开(公告)日: 2024-10-22
- 发明人: Shunpei Yamazaki , Hajime Kimura
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址: JP Atsugi
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi
- 代理机构: Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权: JP 17125011 2017.06.27
- 主分类号: H01L23/522
- IPC分类号: H01L23/522 ; H01L21/48 ; H01L21/56 ; H01L21/66 ; H01L21/68 ; H01L21/768 ; H01L23/00 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H01L23/528 ; H01L23/532 ; H01L25/065 ; H01L27/088 ; H10B41/27 ; H10B43/27
摘要:
A semiconductor device with large memory capacity is provided. A semiconductor device includes first to fourth insulators, a first conductor, a second conductor, and a first semiconductor, and the first semiconductor includes a first surface and a second surface. A first side surface of the first conductor is included on the first surface of the first semiconductor, and a first side surface of the first insulator is included on a second side surface of the first conductor. The second insulator is included in a region including a second side surface and a top surface of the first insulator, a top surface of the first conductor, and the second surface of the first semiconductor. The third insulator is included on a formation surface of the second insulator, and the fourth insulator is included on a formation surface of the third insulator. The second conductor is included in a region overlapping the second surface of the first semiconductor in a region where the fourth insulator is formed. The third insulator has a function of accumulating charge. A tunnel current is induced between the second surface of the first semiconductor and the third insulator with the second insulator therebetween by supply of a potential to the second conductor.
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