- 专利标题: Memory device and method of manufacturing the same
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申请号: US17585824申请日: 2022-01-27
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公开(公告)号: US12125523B2公开(公告)日: 2024-10-22
- 发明人: Yi-Hsin Nien , Hidehiro Fujiwara , Chih-Yu Lin , Yen-Huei Chen
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: G11C11/412
- IPC分类号: G11C11/412 ; G11C11/419 ; H10B10/00
摘要:
A memory device includes a conductive segment, first and second rows of memory cells. The conductive segment receives a first reference voltage signal. The first row of memory cells is coupled to a first word line. The second row of memory cells is coupled to a second word line. The first row of memory cells includes first and second memory cells. The first memory cell is coupled to the conductive segment to receive the first reference voltage signal. The second row of memory cells includes third and fourth memory cells. The third memory cell is coupled to the conductive segment to receive the first reference voltage signal. The first and third memory cells share the conductive segment, and the third memory cell is arranged between the first and second memory cells. The second memory cell is arranged between the third and fourth memory cells.
公开/授权文献
- US20230238056A1 MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 公开/授权日:2023-07-27
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