- 专利标题: Methods of forming epitaxial source/drain features in semiconductor devices
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申请号: US17121073申请日: 2020-12-14
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公开(公告)号: US12119378B2公开(公告)日: 2024-10-15
- 发明人: Jia-Heng Wang , I-Wen Wu , Chen-Ming Lee , Fu-Kai Yang , Mei-Yun Wang
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: HAYNES AND BOONE, LLP
- 分案原申请号: US16409453 2019.05.10
- 主分类号: H01L29/417
- IPC分类号: H01L29/417 ; H01L21/02 ; H01L21/225 ; H01L21/268 ; H01L21/311 ; H01L29/08 ; H01L29/40 ; H01L29/78
摘要:
A semiconductor structure includes semiconductor fins disposed over a substrate, an epitaxial source/drain (S/D) feature disposed over the semiconductor fins, where a top surface portion of the epitaxial S/D feature includes two surfaces slanted downward toward each other at an angle, a silicide layer disposed conformally over the top portion of the epitaxial S/D feature, and an S/D contact disposed over the silicide layer, where a bottom portion of the S/D contact extends into the epitaxial S/D feature.
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