- 专利标题： Semiconductor package and method of fabricating the same
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申请号： US17884499申请日： 2022-08-09
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公开(公告)号： US12057359B2公开(公告)日： 2024-08-06
- 发明人: Chun-Cheng Lin , Ching-Hua Hsieh , Chen-Hua Yu , Chung-Shi Liu , Chih-Wei Lin
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/29 ; H01L23/367 ; H01L23/498 ; H01L23/538 ; H01L25/065 ; B29C45/14 ; B29K63/00 ; B29L31/34
摘要：
A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.
公开/授权文献
- US20220384288A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME 公开/授权日：2022-12-01
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