- 专利标题: Semiconductor structure
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申请号: US17746693申请日: 2022-05-17
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公开(公告)号: US12048133B2公开(公告)日: 2024-07-23
- 发明人: Nan Wang
- 申请人: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- 申请人地址: CN Shanghai
- 专利权人: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- 当前专利权人: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- 当前专利权人地址: CN Shanghai; CN Beijing
- 代理机构: Anova Law Group, PLLC
- 优先权: CN 1910295350.8 2019.04.12
- 分案原申请号: US16845641 2020.04.10
- 主分类号: H10B10/00
- IPC分类号: H10B10/00 ; H01L21/02 ; H01L21/8238 ; H01L27/092 ; H01L29/08 ; H01L29/16 ; H01L29/165 ; H01L29/66 ; H01L29/78
摘要:
Semiconductor structures is provided. The semiconductor structure includes a semiconductor substrate having at least one first region, a plurality of second regions and a plurality of third regions; at least one second fin formed on one second region of the plurality of second region; at least one third fin formed on one third region of the plurality of third regions; a first epitaxial layer formed in the at least one first fin; and a second epitaxial layer formed in the at least one second fin and the at least one third fin.
公开/授权文献
- US20220278109A1 SEMICONDUCTOR STRUCTURE 公开/授权日:2022-09-01
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