发明授权
- 专利标题: Low latency inter-chip communication mechanism in a multi-chip processing system
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申请号: US18123908申请日: 2023-03-20
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公开(公告)号: US12019552B2公开(公告)日: 2024-06-25
- 发明人: Craig Barner , David Asher , Richard Kessler , Bradley Dobbie , Daniel Dever , Thomas F. Hummel , Isam Akkawi
- 申请人: Marvell Asia Pte, Ltd.
- 申请人地址: SG Singapore
- 专利权人: Marvell Asia Pte, Ltd.
- 当前专利权人: Marvell Asia Pte, Ltd.
- 当前专利权人地址: SG Singapore
- 主分类号: G06F12/00
- IPC分类号: G06F12/00 ; G06F12/0813 ; G06F12/084 ; G06F12/0842
摘要:
Systems and methods of multi-chip processing with low latency and congestion. In a multi-chip processing system, each chip includes a plurality of clusters arranged in a mesh design. A respective interconnect controller is disposed at the end of each column. The column is linked to a corresponding remote column in the other chip. A share cache controller in the column is paired with a corresponding cache controller in the remote column, the pair of cache controllers are configured to control data caching for a same set of main memory locations. Communications between cross-chip cache controllers are performed within linked columns of clusters via the column-specific inter-chip interconnect controllers.
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