Invention Grant
- Patent Title: DRAM computation circuit and method
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Application No.: US17589729Application Date: 2022-01-31
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Publication No.: US12014768B2Publication Date: 2024-06-18
- Inventor: Chieh Lee , Chia-En Huang , Yi-Ching Liu , Wen-Chang Cheng , Yih Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G11C11/4091
- IPC: G11C11/4091 ; G11C5/06 ; G11C11/4094 ; G11C11/4096 ; H03K19/20

Abstract:
A memory circuit includes first and second circuits. The first circuit includes a DRAM array including a plurality of bit lines, and the second circuit includes a computation circuit including a sense amplifier circuit. A boundary layer is positioned between the first and second circuits, and the boundary layer includes a plurality of via structures configured to electrically connect the plurality of bit lines to the sense amplifier circuit.
Public/Granted literature
- US20230030605A1 DRAM COMPUTATION CIRCUIT AND METHOD Public/Granted day:2023-02-02
Information query
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