A method of fabricating a semiconductor structure includes providing a first substrate comprising a first side and a second side opposite to the first side. A package is attached to the first side of the first substrate. A second substrate is attached to the second side of the first substrate. A plurality of electrical connectors is bonded between the second side of the first substrate and the second substrate. A lid is attached to the first substrate and the second substrate. The lid includes a ring part and a plurality of overhang parts. The ring part is over the first side of the first substrate. The plurality of overhang parts extends from corner sidewalls of the ring part toward the second substrate. The plurality of overhang parts are laterally aside the plurality of electrical connectors.