Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact
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Application No.: US16719257Application Date: 2019-12-18
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Publication No.: US11908856B2Publication Date: 2024-02-20
- Inventor: Biswajeet Guha , William Hsu , Chung-Hsun Lin , Kinyip Phoa , Oleg Golonzka , Tahir Ghani , Kalyan Kolluru , Nathan Jack , Nicholas Thomson , Ayan Kar , Benjamin Orr
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L29/06

Abstract:
Gate-all-around structures having devices with source/drain-to-substrate electrical contact are described. An integrated circuit structure includes a first vertical arrangement of horizontal nanowires above a first fin. A first gate stack is over the first vertical arrangement of horizontal nanowires. A first pair of epitaxial source or drain structures is at first and second ends of the first vertical arrangement of horizontal nanowires. One or both of the first pair of epitaxial source or drain structures is directly electrically coupled to the first fin. A second vertical arrangement of horizontal nanowires is above a second fin. A second gate stack is over the second vertical arrangement of horizontal nanowires. A second pair of epitaxial source or drain structures is at first and second ends of the second vertical arrangement of horizontal nanowires. Both of the second pair of epitaxial source or drain structures is electrically isolated from the second fin.
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