- 专利标题： Semiconductor device package with stress reduction design and method of forming the same
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申请号： US17460668申请日： 2021-08-30
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公开(公告)号： US11894320B2公开(公告)日： 2024-02-06
- 发明人: Shu-Shen Yeh , Chin-Hua Wang , Po-Chen Lai , Po-Yao Lin , Shin-Puu Jeng
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/52 ; H01L23/16 ; H01L23/053
摘要：
A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, a semiconductor device, a ring structure, a lid structure, and an adhesive member. The semiconductor device is disposed over the substrate. The ring structure is disposed over the substrate and surrounds the semiconductor device. The lid structure is disposed over the ring structure and extends across the semiconductor device. The adhesive member is disposed in a gap between the ring structure and the semiconductor device and attached to the lid structure and the substrate.
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