Invention Grant
- Patent Title: Semiconductor die carrier structure
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Application No.: US17216247Application Date: 2021-03-29
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Publication No.: US11881421B2Publication Date: 2024-01-23
- Inventor: Tzu-Chung Tsai , Ping-Cheng Ko , Fang-yu Liu , Jhih-Yuan Yang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsicnhu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- The original application number of the division: US16448467 2019.06.21
- Main IPC: H01L21/673
- IPC: H01L21/673 ; B29C45/72 ; B29C45/73 ; B29C45/74 ; B29C45/78 ; B29C35/16 ; B29L31/00 ; B29K69/00

Abstract:
An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
Public/Granted literature
- US20210217642A1 SEMICONDUCTOR DIE CARRIER STRUCTURE Public/Granted day:2021-07-15
Information query
IPC分类: