- 专利标题: Systems and methods for shielded inductive devices
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申请号: US17585372申请日: 2022-01-26
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公开(公告)号: US11804515B2公开(公告)日: 2023-10-31
- 发明人: Feng Wei Kuo , Chewn-Pu Jou , Huan-Neng Chen , Lan-Chou Cho , Robert Bogdan Staszewski
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Duane Morris LLP
- 分案原申请号: US15965476 2018.04.27
- 主分类号: H01L23/522
- IPC分类号: H01L23/522 ; H03L7/085 ; H01L49/02 ; H01F27/28 ; H03L7/099 ; B01D1/00 ; B01D1/12 ; C02F1/04 ; C02F11/12 ; C02F11/18 ; C02F101/30 ; C02F103/14 ; C02F103/16 ; C02F103/28 ; C02F103/32 ; C02F103/34 ; C02F103/36
摘要:
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
公开/授权文献
- US20220149146A1 SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES 公开/授权日:2022-05-12
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