Invention Grant
- Patent Title: Method of manufacturing integrated circuit device
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Application No.: US17715192Application Date: 2022-04-07
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Publication No.: US11776962B2Publication Date: 2023-10-03
- Inventor: Hong-sik Shin , Heung-sik Park , Do-haing Lee , In-keun Lee , Seung-ho Chae , Ha-young Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20180106107 2018.09.05
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L29/78 ; H01L29/66 ; H10B10/00

Abstract:
An integrated circuit device is provided. The integrated circuit device includes a fin-type active region that extends in a first direction on a substrate, a gate structure that intersects with the fin-type active region and extends in a second direction, perpendicular to the first direction, on the substrate, and a first contact structure that is disposed on the gate structure, and has a greater width at a top surface than a bottom surface thereof.
Public/Granted literature
- US20220231025A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2022-07-21
Information query
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