发明授权
- 专利标题: Fusion memory
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申请号: US17424998申请日: 2019-01-28
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公开(公告)号: US11776607B2公开(公告)日: 2023-10-03
- 发明人: Hangbing Lv , Qing Luo , Xiaoxin Xu , Tiancheng Gong , Ming Liu
- 申请人: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- 申请人地址: CN Beijing
- 专利权人: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- 当前专利权人: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- 当前专利权人地址: CN Beijing
- 代理机构: Westman, Champlin & Koehler, P.A.
- 国际申请: PCT/CN2019/073434 2019.01.28
- 国际公布: WO2020/154843A 2020.08.06
- 进入国家日期: 2021-07-22
- 主分类号: G11C11/22
- IPC分类号: G11C11/22 ; H01L29/78 ; G06N3/063 ; H01L29/51 ; H10B51/20 ; H10B51/30
摘要:
The present disclosure provides a fusion memory including a plurality of memory cells, wherein each memory cell of the plurality of memory cells includes: a bulk substrate; a source and a drain on the bulk substrate; a channel extending between the source and the drain; a ferroelectric layer on the channel; and a gate on the ferroelectric layer.
公开/授权文献
- US20220093150A1 FUSION MEMORY 公开/授权日:2022-03-24
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