Invention Grant
- Patent Title: Flex bus protocol negotiation and enabling sequence
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Application No.: US17485337Application Date: 2021-09-25
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Publication No.: US11726939B2Publication Date: 2023-08-15
- Inventor: Debendra Das Sharma , Michelle C. Jen , Prahladachar Jayaprakash Bharadwaj , Bruce Tennant , Mahesh Wagh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42
![Flex bus protocol negotiation and enabling sequence](/abs-image/US/2023/08/15/US11726939B2/abs.jpg.150x150.jpg)
Abstract:
Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.
Public/Granted literature
- US20220012203A1 FLEX BUS PROTOCOL NEGOTIATION AND ENABLING SEQUENCE Public/Granted day:2022-01-13
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