- 专利标题: Substrate support with real time force and film stress control
-
申请号: US17095577申请日: 2020-11-11
-
公开(公告)号: US11676802B2公开(公告)日: 2023-06-13
- 发明人: Wendell Glenn Boyd, Jr. , Govinda Raj , Matthew James Busche
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson + Sheridan, LLP
- 主分类号: G01D5/26
- IPC分类号: G01D5/26 ; H01J37/32 ; H01L21/683 ; C23C16/458 ; G01L11/02 ; G01D11/24
摘要:
Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to provide the benefit of allowing gas to flow past the sensor assembly when positioned in the gas hole.
公开/授权文献
信息查询