Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US17330246Application Date: 2021-05-25
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Publication No.: US11664383B2Publication Date: 2023-05-30
- Inventor: Hsueh-Chih Chou , Chia Hao Tu , Sang Hoo Dhong , Lee-Chung Lu , Li-Chun Tien , Ting-Wei Chiang , Hui-Zhong Zhuang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: H01L27/118
- IPC: H01L27/118 ; H01L27/02

Abstract:
A semiconductor structure is disclosed. The semiconductor structure includes: a first standard cell; and a second standard cell; wherein a cell width of the first standard cell along a first direction is substantially the same as a cell width of the second standard cell along the first direction, and a cell height of the first standard cell along a second direction perpendicular to the first direction is substantially greater than a cell height of the second standard cell along the second direction.
Public/Granted literature
- US20210280608A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2021-09-09
Information query
IPC分类: