- 专利标题： Test kit for testing a device under test
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申请号： US17211738申请日： 2021-03-24
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公开(公告)号： US11624758B2公开(公告)日： 2023-04-11
- 发明人: Sheng-Wei Lei , Chang-Lin Wei , Ying-Chou Shih , Yeh-Chun Kao , Yen-Ju Lu , Po-Sen Tseng
- 申请人： MEDIATEK INC.
- 申请人地址： TW Hsin-Chu
- 专利权人： MEDIATEK INC.
- 当前专利权人： MEDIATEK INC.
- 当前专利权人地址： TW Hsin-Chu
- 代理商 Winston Hsu
- 主分类号： G01R1/04
- IPC分类号： G01R1/04 ; H04B17/29
摘要：
A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.
公开/授权文献
- US20210302467A1 TEST KIT FOR TESTING A DEVICE UNDER TEST 公开/授权日：2021-09-30
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