Invention Grant
- Patent Title: Selective underfill assembly and method therefor
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Application No.: US16669579Application Date: 2019-10-31
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Publication No.: US11557491B2Publication Date: 2023-01-17
- Inventor: Leo van Gemert , Peter Joseph Hubert Drummen
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L21/48 ; H01L23/66
Abstract:
A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.
Public/Granted literature
- US20210134612A1 SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR Public/Granted day:2021-05-06
Information query
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