- 专利标题: Contacts for semiconductor devices and methods of forming the same
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申请号: US17146205申请日: 2021-01-11
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公开(公告)号: US11417739B2公开(公告)日: 2022-08-16
- 发明人: Meng-Han Lin , Sai-Hooi Yeong , Chi On Chui
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L29/417
- IPC分类号: H01L29/417 ; H01L29/40 ; H01L21/8234 ; H01L27/088 ; H01L29/10 ; H01L27/092 ; H01L29/66
摘要:
Methods for forming contacts to source/drain regions and gate electrodes in low- and high-voltage devices and devices formed by the same are disclosed. In an embodiment a device includes a first channel region in a substrate adjacent a first source/drain region; a first gate over the first channel region; a second channel region in the substrate adjacent a second source/drain region, a top surface of the second channel region being below a top surface of the first channel region; a second gate over the second channel region; an ILD over the first gate and the second gate; a first contact extending through the ILD and coupled to the first source/drain region; and a second contact extending through the ILD, coupled to the second source/drain region, and having a width greater a width of the first contact and a height greater than a height of the first contact.
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