- 专利标题: Chemical supply structure and a developing apparatus having the same
-
申请号: US16445969申请日: 2019-06-19
-
公开(公告)号: US11415889B2公开(公告)日: 2022-08-16
- 发明人: Jong-Keun Oh , Kyoung-Noh Kim , Man-Kyu Kang , Byung-Gook Kim
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Lee IP Law, P.C.
- 优先权: KR10-2018-0136286 20181108
- 主分类号: G03G15/10
- IPC分类号: G03G15/10 ; G03F7/30 ; B05B1/00 ; B05C5/00 ; H01L21/67 ; B41J2/16 ; G03F7/20 ; G03F7/00 ; G03F7/32 ; B05B1/28 ; B05C5/02 ; B05C11/10 ; H01L21/687
摘要:
A chemical supply structure includes a bar-shaped body having a plurality of chemical reservoirs in which a plurality of chemicals is individually stored such that the body partially crosses an underlying substrate, a bar-shaped nozzle protruded from a bottom surface of the body and injecting injection chemicals onto the substrate, a plurality of the chemicals being mixed into the injection chemicals, and a hydrophobic unit arranged on the bottom surface of the body and on a side surface of the nozzle such that a mixed solution mixed with the injection chemicals is prevented from adhering to the bottom surface and the side surface by controlling a contact angle of the mixed solution with respect to the bottom surface and the side surface.
公开/授权文献
信息查询