Invention Grant
- Patent Title: Advanced lithography and self-assembled devices
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Application No.: US17110215Application Date: 2020-12-02
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Publication No.: US11373950B2Publication Date: 2022-06-28
- Inventor: Richard E. Schenker , Robert L. Bristol , Kevin L. Lin , Florian Gstrein , James M. Blackwell , Marie Krysak , Manish Chandhok , Paul A. Nyhus , Charles H. Wallace , Curtis W. Ward , Swaminathan Sivakumar , Elliot N. Tan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L23/532 ; H01L27/088 ; H01L29/78
Abstract:
Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.
Public/Granted literature
- US20210082800A1 ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES Public/Granted day:2021-03-18
Information query
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