- 专利标题: Printed circuit board including electroconductive pattern and electronic device including printed circuit board
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申请号: US16200401申请日: 2018-11-26
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公开(公告)号: US11363711B2公开(公告)日: 2022-06-14
- 发明人: Jaehoon Jo , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jinwoo Jung , Jaebong Chun , Eunseok Hong
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KRKR10-2017-0160993 20171128
- 主分类号: H01Q1/22
- IPC分类号: H01Q1/22 ; H01Q1/38 ; H05K1/02 ; H01Q15/00 ; H01Q21/28 ; H01Q9/04 ; H01Q21/00 ; H01Q21/08
摘要:
According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.
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