- 专利标题: Silicon carbide trench semiconductor device
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申请号: US16779374申请日: 2020-01-31
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公开(公告)号: US11245016B2公开(公告)日: 2022-02-08
- 发明人: David Sheridan , Vipindas Pala , Madhur Bobde
- 申请人: Alpha and Omega Semiconductor (Cayman) Ltd.
- 申请人地址: KY Grand Cayman
- 专利权人: Alpha and Omega Semiconductor (Cayman) Ltd.
- 当前专利权人: Alpha and Omega Semiconductor (Cayman) Ltd.
- 当前专利权人地址: KY Grand Cayman
- 代理机构: JDI Patent
- 代理商 Joshua Isenberg; Robert Pullman
- 主分类号: H01L21/04
- IPC分类号: H01L21/04 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/16 ; H01L29/10 ; H01L29/08 ; H01L29/04 ; H01L29/36
摘要:
A semiconductor apparatus has a silicon carbide substrate heavily doped with the first conductivity type and a lightly doped silicon carbide drift region of the first conductivity type over the silicon carbide substrate. A first body region in the drift region is doped with second conductivity type opposite the first. A first source region in the first body region is heavily doped with the first conductivity type. A gate trench is formed in the first source region and first body region. At least one sidewall of the gate trench is parallel to a crystal plane of the silicon carbide structure having greater carrier mobility than a C-face thereof. The gate trench extends a length of the first body region and the source region to a separation region laterally adjacent to the first region wherein the separation region is in the drift region.
公开/授权文献
- US20210242319A1 SILICON CARBIDE TRENCH SEMICONDUCTOR DEVICE 公开/授权日:2021-08-05
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