- 专利标题: Silicon carbide device with trench gate structure and method of manufacturing
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申请号: US16832653申请日: 2020-03-27
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公开(公告)号: US11211468B2公开(公告)日: 2021-12-28
- 发明人: Ralf Siemieniec , Wolfgang Jantscher , David Kammerlander
- 申请人: Infineon Technologies AG
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 优先权: DE102019108062.2 20190328
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/66 ; H01L21/04 ; H01L29/16 ; H01L29/78 ; H01L29/10
摘要:
A silicon carbide device includes a silicon carbide body with a trench gate structure that extends from a first surface into the silicon carbide body. A body region is in contact with an active sidewall of the trench gate structure. A source region is in contact with the active sidewall and located between the body region and the first surface. The body region includes a first body portion directly below the source region and distant from the active sidewall. In at least one horizontal plane parallel to the first surface, a dopant concentration in the first body portion is at least 150% of a reference dopant concentration in the body region at the active sidewall and a horizontal extension of the first body portion is at least 20% of a total horizontal extension of the body region.
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