- 专利标题: Soft magnetic alloy embodiments for additive manufacturing and geometric structures formed therefrom
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申请号: US16786845申请日: 2020-02-10
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公开(公告)号: US11155903B2公开(公告)日: 2021-10-26
- 发明人: Alexander Plotkowski , Ryan Dehoff , Frederick List, III , Jason Pries , Benjamin Stump , Keith Carver , Peeyush Nandwana
- 申请人: UT-Battelle, LLC
- 申请人地址: US TN Oak Ridge
- 专利权人: UT-Battelle, LLC
- 当前专利权人: UT-Battelle, LLC
- 当前专利权人地址: US TN Oak Ridge
- 代理机构: Klarquist Sparkman, LLP
- 主分类号: B33Y80/00
- IPC分类号: B33Y80/00 ; C22C38/02 ; B33Y10/00 ; B33Y70/00 ; C22C38/00 ; B23K26/34 ; B23K26/354
摘要:
Disclosed herein are embodiments of soft magnetic alloy embodiments for use in additive manufacturing and structures fabricated from such alloys. In some embodiments, the fabricated structures comprise a continuous thin wall (or plurality thereof) having a geometry that promotes reduced eddy current losses and other performance enhancements. In some embodiments, the fabricated structures are used to make components, such as transformer cores and/or electric motors.
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