Invention Grant
- Patent Title: DRAM and flash structure and method of fabricating the same
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Application No.: US16145164Application Date: 2018-09-28
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Publication No.: US11069690B2Publication Date: 2021-07-20
- Inventor: Shih-Kuei Yen , Li-Wei Liu , Le-Tien Jung , Hung-Lin Shih , Hsuan-Tung Chu , Ming-Che Li , Guan-Yi Liou , Huai-Jin Hsing
- Applicant: UNITED MICROELECTRONICS CORP. , Fujian Jinhua Integrated Circuit Co., Ltd.
- Applicant Address: TW Hsin-Chu; CN Quanzhou
- Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee Address: TW Hsin-Chu; CN Quanzhou
- Agent Winston Hsu
- Priority: CN201811042392.2 20180907
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L27/11519 ; H01L27/11551 ; H01L27/11526

Abstract:
A flash includes a substrate comprising an active region and two electron storage structures disposed at two sides of the active region, wherein each of the electron storage structures comprises a silicon oxide/silicon nitride/silicon oxide composite layer. A buried gate is embedded in the active region, wherein the buried gate only consists of a control gate and a gate dielectric layer, and the gate dielectric layer is formed by a single material. Two source/drain doping regions are disposed in the active region at two sides of the buried gate.
Public/Granted literature
- US20200083228A1 DRAM AND FLASH STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2020-03-12
Information query
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