- 专利标题: Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes
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申请号: US16213816申请日: 2018-12-07
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公开(公告)号: US11031273B2公开(公告)日: 2021-06-08
- 发明人: Bonnie T Chia , Ross Marshall , Tomoharu Matsushita , Cheng-Hsiung Tsai
- 申请人: APPLIED MATERIALS, INC.
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Moser Taboada
- 主分类号: H01L21/683
- IPC分类号: H01L21/683 ; H01L21/67 ; F24F3/00 ; H02N13/00
摘要:
Embodiments of an electrostatic chuck are provided herein. In some embodiments an electrostatic chuck includes an electrode, a dielectric body having a disk shape and covering the electrode, the dielectric body including a central region and a peripheral region, and the dielectric body including a lower surface having a central opening and an upper surface having a first opening in the central region and a plurality of second openings in the peripheral region, wherein the upper surface includes a plurality of protrusions and a diameter of each of the plurality of second openings is greater than 25.0 mils, and gas distribution channels that extend from the lower surface to the upper surface to define a plenum within the dielectric body.
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