- 专利标题： Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
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申请号： US16390669申请日： 2019-04-22
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公开(公告)号： US11004771B2公开(公告)日： 2021-05-11
- 发明人: Cheng-Chieh Hsieh , Chi-Hsi Wu , Shin-Puu Jeng , Tsung-Yu Chen , Wensen Hung
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/427
- IPC分类号： H01L23/427 ; H01L23/367 ; H01L23/373 ; H01L25/10 ; H01L23/00 ; H01L21/56 ; H01L23/34 ; H01L23/31
摘要：
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a cooling device for a semiconductor device includes a reservoir having a first plate and a second plate coupled to the first plate. A cavity is between the first plate and the second plate. A phase change material (PCM) is in the cavity. The cooling device is adapted to dissipate heat from a packaged semiconductor device.
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