An electrode structure is located at least partially in a via opening having a small feature size and containing a fuse element which is composed of a fuse element-containing seed layer that is subjected to a reflow anneal. The electrode structure is composed of a material having a higher electromigration (EM) resistance than the material that provides the fuse element. Prior to programming, the fuse element is present along sidewalls and a bottom wall of the electrode structure. After programming, a void is formed in the fuse element along at least one sidewall of the electrode structure and the resistance of the device will increase sharply.